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tb62710p/f/fn 2006-06-14 1 toahiba bi-cmos integrated circuit silicon monolithic tb62710p,tb62710f,TB62710FN 8-bit constant-current led driver for cathode common led the tb62710p, tb62710f and TB62710FN are specifically designed for use as led and led display (cathode-common) constant-current drivers. the constant-current output circuits can be set up using an external resistor (iout = ? 90 ma max). these ics are monolithic integrated circuits have been designed using the bi-cmos process. the devices consist of an 8-bit shift register, a latch, an andgate and constant-current drivers. features ? constant-current output: a single resistor can be used to set any output current in the range ? 5~ ? 90 ma. ? maximum clock frequency: f clk = 15 mhz (operating while connected in cascade, t opr = 25c) ? 5-v cmos compatible input ? packages: p-type: dip20-p-300-2.54a f-type: ssop24-p-300-1.00 fn-type: ssop20-p-225-0.65a ? constant-output-current accuracy: current accuracy output ? gnd voltage between bits between ics output current (max) 2.0 v (min) ? 5~ ? 90 ma 1.5 v (min) 6% 15% ? 5~ ? 40 ma tb62710p tb62710f TB62710FN weight dip20-p-300-2.54a: 2.25 g (typ.) ssop24-p-300-1.00: 0.33 g (typ.) ssop20-p-225-0.65a: 0.10 g (typ.)
tb62710p/f/fn 2006-06-14 2 pin assignment (top view) block diagram truth table clock latch enable serial-in out0 out5 out7 serial-out h l dn dn dn ? 5 dn ? 7 dn ? 7 l l dn + 1 no change dn ? 6 h l dn + 2 dn + 2 dn ? 3 dn ? 5 dn ? 5 x l dn + 3 dn + 2 dn ? 3 dn ? 5 dn ? 5 x h dn + 3 off dn ? 5 note 1: out0~out7 = on when dn = ?h?; out0~out7 = off when dn = ?l?. in order to ensure that the level of the power supply voltate is correct, an external resistor must be connected between r-ext and gnd. gnd serial-in latch cloc k nc v cc out0 out1 v dd r-ext serial-out1 enable serial-out2 v cc out7 out6 p- & fn-types out2 out5 out3 out4 gnd serial-in latch clock nc v cc out0 out1 v dd r-ext serial-out1 enable serial-out2 nc out7 out6 f-type out2 out5 out3 out4 nc nc nc v cc serial-in latch r-ex t enable i-reg q st d q st d d q ck q st d d q ck d q ck clock out0 out1 out7 serial-out1 v cc v cc v cc d q ck serial-out2
tb62710p/f/fn 2006-06-14 3 timing diagram note 2: the latches circuit holds data by pulling the latch terminal low. and, when latch terminal is a ?h? level, latch circuit doesn?t hold data, and it passes from the input to the output. when enable terminal is a ?l? level, output terminal out0~ out7 respond to the data, and on & off does. and, when enable terminal is a ?h? level, it offs with the output terminal regardless of the data. serial-in latch clock out0 out1 out6 enable n = 1 23 4 5678 serial-out2 serial-out1 out7 off off on off off off on off 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v 5 v 0 v
tb62710p/f/fn 2006-06-14 4 terminal description pin no. p/fn-type f-type pin name function 1 1 gnd gnd terminal for control logic 2 2 serial-in input terminal for serial data for data shift register 3 3 clock input terminal for clock for data shift on rising edge 4 5 latch input terminal for data strobe when the latch input is driven high, data is latched. when it is pulled low, data is hold. 6, 15 7, 18 v cc 0 v~17 v supply voltage terminal for led 7~14 9~16 out0~out7 output terminals 17 21 enable input terminal for output enable. all outputs (out0~out7) are turned off, when the enable terminal is driven high. and are turned on, when the terminal is driven low. 16 20 serial-out2 output terminal for serial data input on serial-in terminal 18 22 serial-out1 output terminal for serial data input on serial-in terminal 19 23 r-ext input terminal used to connect an external resistor. this regulated the output current. 20 24 v dd 5-v supply voltage terminal 5 4, 6, 8, 17, 19 nc not connected equivalent circuits for inputs and outputs enable terminal latch terminal clock, serial-in terminal serial-out1 and serial-out2 terminals clock, serial-in v dd gnd 300 k v dd enable gnd r (up) v dd latch gnd r (down) 200 k v dd gnd serial-out1, 2
tb62710p/f/fn 2006-06-14 5 absolute maximum ratings (t opr = 25c) characteristic symbol rating unit supply voltage v dd 0~7.0 v supply voltage for led v led 0~17.0 v input voltage v in ? 0.4~v dd + 0.4 v output current i out ? 90 ma output voltage v out ? 0.4~17 v clock frequency f clk 15 mhz v cc terminal current iv cc 1440 ma p-type (when not mounted) p d1 1.47 f-type (when not mounted) 0.59 f-type (on pcb) p d2 0.83 fn-type (when not mounted) 0.71 power dissipation (note 3) fn-type (on pcb) p d3 0.96 w p-type (when not mounted) r th (j-a) 1 85 f-type (when not mounted) 210 f-type (on pcb) r th (j-a) 2 150 fn-type (when not mounted) 175 thermal resistance (note 3) fn-type (on pcb) r th (j-a) 3 130 c/w operating temperature t opr ? 40~85 c storage temperature t stg ? 55~150 c note 3: p-type: powes dissipation is derated by 12.5 mw/c if device is mounted on pcb and ambient temperature is above 25c. f-type: powes dissipation is derated by 6.7 mw/c if device is mounted on pcb and ambient temperature is above 25c. with device mounted on pcb of 60% cu and of dimensions 50 mm 50 mm 1.6 mm fn-type: powes dissipation is derated by 7.7 mw/c if device is mounted on pcb and ambient temperature is above 25c. with device mounted on pcb of 40% cu and of dimensions 50 mm 50 mm 1.6 mm
tb62710p/f/fn 2006-06-14 6 recommended operating conditions (t opr = ? 40c ~85c unless otherwise specified) characteristic symbol conditions min typ. max unit supply voltage v dd ? 4.5 5.0 5.5 v v cc1 v cc ? v out > = < = ? 90 ma 4 ? 17 supply voltage for led v cc2 v cc ? v out > = < = ? 40 ma 3.5 ? 17 v output voltage v out v cc common 0 ? ? 17 v i out dc1 circuit ? 5 ? ? 78 i oh serial-out1, 2 ? ? ? 1.0 output current i ol serial-out1, 2 ? ? 1.0 ma v ih 0.7 v dd ? v dd + 0.3 input voltage v il v dd = 4.5~5.5 v ? 0.3 ? 0.3 v dd v latch pulse width t wlat v dd = 4.5~5.5 v 100 ? ? ns clock pulse width t wclk v dd = 4.5~5.5 v 50 ? ? ns enable pulse width t wena v dd = 4.5~5.5 v 1000 ? ? ns set-up time for data t setup v dd = 4.5~5.5 v 100 ? ? ns hold time for data t hold v dd = 4.5~5.5 v 100 ? ? ns clock frequency t clk v dd = 4.5~5.5 v, cascade operation ? ? 10.0 ns p-type p d1 when not mounted ? ? 0.76 f-type p d2 ? ? 0.43 power dissipation fn-type p d3 t opr = 85c on pcb ? ? 0.50 w
tb62710p/f/fn 2006-06-14 7 electrical characteristics (t opr = 25c, v dd = 5 v, v cc = 17 v unless otherwise specified) characteristic symbol test circuit conditions min typ. max unit output leakage current i leak ? v cc = 17.0 v ? ? ? 10 a v oh ? i oh = ? 1.0 ma ? ? 0.4 output voltage serial-out 1, 2 v ol ? i ol = 1.0 ma 4.6 ? ? v i out1 ? v cc = 4 v, v out = v cc ? 2.0 v r ext = 360 ? ? 62.1 ? 73.0 ? 83.9 i out2 ? v cc = 4 v, v out = v cc ? 2.0 v r ext = 620 ? ? 34.0 ? 40.0 ? 46.0 output current (including current skewing) i out3 ? v cc = 3.5 v, v out = v cc ? 1.5 v r ext = 620 ? ? 32.3 ? 38.0 ? 43.7 ma current skew ? i out ? same as i out1 , i out2 and i out3 ? 1.5 6.0 % supply voltage regulation %/v dd ? ta = ? 40~85c r ext = 360 ? ? 1.5 5.0 %/v pull-up resistor r in (up) ? ? 150 300 600 k ? pull-down resistor r in (down) ? ? 100 200 400 k ? i dd (off) ? all outputs = off r ext = open ? 0.6 1.2 i dd (on) 1 ? data = all ?h?, all outputs = on (no load) r ext = 360 ? ? 7.5 10.0 v dd i dd (on) 2 ? data = all ?h?, all outputs = on (no load) r ext = 620 ? ? 4.0 7.0 i cc (off) ? data = all ?l?, all outputs = off (no load) r ext = 620 ? ? 0.5 1.0 supply current v cc i cc (on) ? data = all ?h?, all outputs = on (no load) r ext = 360 ? ? 42.0 52.0 ma
tb62710p/f/fn 2006-06-14 8 switching characteristics (t opr = 25c unless otherwise specifed ) characteristic symbol test circuit conditions min typ. max unit clk-outn ? latch -outn ? enable -outn ? ? 200 450 propagation delay time (?l? to ?h?) clk-soutn t plh ? ? 20 70 ns clk-outn ? latch -outn ? enable -outn ? ? 60 180 propagation delay time (?h? to ?l?) clk-soutn t phl ? ? 20 70 ns clk t wclk ? ? 20 30 pulse width latch t wlat ? ? 10 25 ns ? set-up time latch /sin/ clock data = ?l? ?h? t setup ? ? 25 50 ns ? hold time latch /sin/ clock data = ?h? ?l? t hold ? ? 0 30 ns rise time (note 4) t r ? ? ? 10 s slow clock fall time (note 4) t f ? ? ? 10 s output rise time t or ? 25 55 110 ns output fall time t of ? v dd = 5.0 v, v cc = 17.0 v v out = v cc ? 2.0 v v ih = v dd , v il = gnd r ext = 620 ? c l = 10.5 pf t or : 10~90% t of : 90~10% t plh : 50~10% t phl : 50~90% set the switching characteristics according to the result of measuring the voltage waveform. 250 450 600 ns note 4: if the device is connected in a cascade and t r /t f for the waveform is large, it may not be possible to achieve the timing required for data transfer. please consider the timings carefully.
tb62710p/f/fn 2006-06-14 9 test circuit dc characteristic ac characteristic gnd serial-in latch clock out0 serial-out1, serial-out2 enable out7 i il , i ih v dd i dd v il , v ih i out v cc i led c l r l c l gnd serial-in latch clock out0 serial-out1, 2 enable out7 v dd v cc function generator v ih , v il r l c l logic input waveform v dd = v ih = 5.0 v v il = 0 v t r = t f = 10 ns (10% to 90%)
tb62710p/f/fn 2006-06-14 10 timing waveforms 1. clock, serial outn 2. clock, latch 3. enable ? outn t r 90% serial-in clock outn t r 50% 10% 10% t wclk 50% 50% 50% t setup serial-out1 90% t of 50% 10% t or 10% 50% 90% t plh t phl 50% t plh 50% t phl serial-out2 50% 50% t plh t phl latch t wclk serial-in clock 50% t setup 50% 50% 50% t wlat outn enable t plh 50% 50% 50% 50% t phl on off
tb62710p/f/fn 2006-06-14 11 reference data (duty curves + package power dissipation) duty (%) i out (ma) duty (%) i out ? duty on pcb duty (%) i out (ma) i out ? duty on pcb t opr (c) p d ? t opr p d (w/ic) 0 0 25 50 0.5 1.0 1.5 2.0 75 100 p-type free air f-type on pcb fn-type on pcb 90 80 60 40 20 0 70 50 30 10 100 1000 10000 25c v dd = 5.0 v, v ce = 2.0 v, v cc = 17.0 v 5000 500 i out (ma) = (1.26 r ext ( ? )) 18 85c t opr = ? 40c r ext ( ? ) i out (ma) i out ? r ext i out ? duty on pcb i out (ma) 0 0 20 40 60 80 100 10 20 30 40 50 60 70 80 t opr = 85c, v cc ? v out = 2.0 v tj = 120c TB62710FN tb62710f tb62710p 0 0 20 40 60 80 100 10 20 30 40 50 60 70 80 t opr = 60c, v cc ? v out = 2.0 v tj = 120c TB62710FN tb62710f tb62710p 0 0 20 40 60 80 100 10 20 30 40 50 60 70 80 t opr = 25c, v cc ? v out = 2.0 v tj = 120c TB62710FN tb62710f tb62710p
tb62710p/f/fn 2006-06-14 12 the bottom figure shows an application circuit. for best results, this ic should be operated with v o = 2.0 v. v o (v) = v cc ? v out = v cc ? v f (led) ? v ce1 when v cc is high and the v f of the led is low. v o is also high , the increase in power dissipation may in turn adversely affect the ic?s output current. in this case, reduce the voltage by connecting an external resistor. in this way the ic?s output current can be stabilized. (max) number bit (max) out i (min) o v f v cc v r ? ? = it is looked for. it is also possible that the ic will operate in an unstable manner due to the inductance of the wiring. to counter this, it is recommended that the ic be situated as close as possible on the pcb to the led module, and as far as possible from other ics. otherwise, there is the risk that the ic will malfunction. application cpu scan v dd n r gnd serial-in latch clock out0 serial-out1, serial-out2 enable out7 v cc v cc r-ext gnd serial-in latch clock out0 serial-out1, serial-out2 enable out7 v cc v cc r-ext v led = 5~17 (v) v o = v cc ? v f (led) ? v ce1 for best results, operate at v o = 2.0 v v ce1
tb62710p/f/fn 2006-06-14 13 notes ? operation may become unstable due to the electromagnetic interference caused by the wiring and other phenomena. to counter this, it is recommended that the ic be situated as close as possible to the led module. if overvoltage is caused by inductance between the led and the output terminals, both the led and the terminals may suffer damage as a result. ? there is only one gnd terminal on this device when the inductance in the gnd line and the resistor are large, the device may malfunction due to the gnd noise when output switchings by the circuit board pattern and wiring. to achieve stable operation, it is necessary to connect a resistor between the rext terminal and the gnd line. fluctuation in the output waveform is likely to occur when the gnd line is unstable or when a capacitor (of more than 50 pf) is used. therefore, take care when designing the circuit board pattern layout and the wiring from the controller. ? this application circuit is a reference example and is not guaranteed to work in all conditions. be sure to check the operation of your circuits. ? this device does not include protection circuits for overvoltage, overcurrent or overtemperature. if protection is necessary, it must be incorporated into the control circuitry. ? the device is likely to be destroyed if a short-circuit occurs between either of the power supply pins and any of the output terminals when designing circuits, pay special attention to the positions of the output terminals and the power supply terminals (v dd and v led ), and to the design of the gnd line.
tb62710p/f/fn 2006-06-14 14 package dimensions weight: 2.25 g (typ.)
tb62710p/f/fn 2006-06-14 15 package dimensions weight: 0.33 g (typ.)
tb62710p/f/fn 2006-06-14 16 package dimensions weight: 0.10 g (typ.)
tb62710p/f/fn 2006-06-14 17 notes on contents 1. block diagrams some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the device characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
tb62710p/f/fn 2006-06-14 18 ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. if there is a large amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. points to remember on handling of ics (1) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (tj) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (2) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
tb62710p/f/fn 2006-06-14 19 restrictions on product use 060116eba ? the information contained herein is subject to change without notice. 021023_d ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizi ng toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handli ng guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc. 021023_a ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. 021023_b ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_q ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of toshiba or others. 021023_c ? the products described in this document are subject to the foreign exchange and foreign trade laws. 021023_e

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